臺灣HELE晶振,X2C032000BA1HA-U,HSX211S貼片晶振,6G通信設備晶振,臺灣HELE晶振,HSX211S貼片晶振,2016mm小體積晶振,無源晶振,X2C032000BA1HA-U晶振,頻率32MHz,負載10pf,工作溫度-40~85°C,頻率穩定性10ppm,高精度晶振,高可靠性晶振,6G通信設備晶振,智能手機晶振,平板電腦晶振,藍牙模塊晶振.
臺灣HELE晶振,X2C032000BA1HA-U,HSX211S貼片晶振,6G通信設備晶振特點 :
1.超微型貼片型晶體器件
2.精度高，可靠性好，耐熱性好
3.為設計空間有限的智能手機應用、小型化無線模塊設備、RFID應用和其他消費類產品提供最佳解決方案
臺灣HELE晶振,X2C032000BA1HA-U,HSX211S貼片晶振,6G通信設備晶振 參數
| 項目 | 符號 | HSX211S |
| 頻率 | f0 | 32MHz |
| 振動模式 |
|
Fundamental |
| 頻率公差 | △f/f0 | ±10ppm |
| 溫度穩定性 | TC |
±10ppm |
| 負載電容 | CL | 10pf |
| 工作溫度 | TOPR | －40℃～＋85℃ |
| 保存溫度 | TSTR | －40℃～＋125℃ |
| 串聯阻力 | R1 | 80Ω Max. |
| 驅動級別 | DL | 100μW Max |
臺灣HELE晶振,X2C032000BA1HA-U,HSX211S貼片晶振,6G通信設備晶振尺寸圖
| 原廠編碼 | 制造廠家 | 型號 | 頻率 | 負載 | 頻率容差 | 頻率穩定性 | 工作溫度 | 尺寸 |
| X2C032000BA1HA-U | HELE晶振 | HSX211S | 32MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C012000BA1HA-U | HELE晶振 | HSX211S | 12MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C013000BA1HA-U | HELE晶振 | HSX211S | 13MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C014000BA1HA-U | HELE晶振 | HSX211S | 14MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C015000BA1HA-U | HELE晶振 | HSX211S | 15MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C016000BA1HA-U | HELE晶振 | HSX211S | 16MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C017000BA1HA-U | HELE晶振 | HSX211S | 17MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C018000BA1HA-U | HELE晶振 | HSX211S | 18MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C019000BA1HA-U | HELE晶振 | HSX211S | 19MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C020000BA1HA-U | HELE晶振 | HSX211S | 20MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C021000BA1HA-U | HELE晶振 | HSX211S | 21MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C022000BA1HA-U | HELE晶振 | HSX211S | 22MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C023000BA1HA-U | HELE晶振 | HSX211S | 23MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C024000BA1HA-U | HELE晶振 | HSX211S | 24MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C025000BA1HA-U | HELE晶振 | HSX211S | 25MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C026000BA1HA-U | HELE晶振 | HSX211S | 26MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C027000BA1HA-U | HELE晶振 | HSX211S | 27MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C028000BA1HA-U | HELE晶振 | HSX211S | 28MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C029000BA1HA-U | HELE晶振 | HSX211S | 29MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C030000BA1HA-U | HELE晶振 | HSX211S | 30MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C031000BA1HA-U | HELE晶振 | HSX211S | 31MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C048000BA1HA-U | HELE晶振 | HSX211S | 48MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C033000BA1HA-U | HELE晶振 | HSX211S | 33MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C034000BA1HA-U | HELE晶振 | HSX211S | 34MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C035000BA1HA-U | HELE晶振 | HSX211S | 35MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C036000BA1HA-U | HELE晶振 | HSX211S | 36MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C037000BA1HA-U | HELE晶振 | HSX211S | 37MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C038000BA1HA-U | HELE晶振 | HSX211S | 38MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C039000BA1HA-U | HELE晶振 | HSX211S | 39MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C040000BA1HA-U | HELE晶振 | HSX211S | 40MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C041000BA1HA-U | HELE晶振 | HSX211S | 41MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C042000BA1HA-U | HELE晶振 | HSX211S | 42MHz | 10pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
| X2C037400BG1HA-U | HELE晶振 | HSX211S | 37.4MHz | 16pF | ±10PPM | ±20PPM | -40~85°C | 2.0×1.6mm |
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